Cdte: 145 results found.
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PDMS Microfluidics
PDMS stamps are pieces of Polydimethylsiloxane (PDMS) that have been patterned usually against a master to form a relief pattern used in soft lithography. This PDMS stamp can be used in either its current form as a relief surface for techniques such as Micro Contact Printing or can also be attached to an external source by tubing so that liquid may be past through channels on its surface. It is possible to pattern PDMS to micrometre scale. These kinds of devices are often referred to as microfluidic devices.
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Semiconductor Processing
Semiconductor device processing is used to create the integrated circuits (silicon chips) that are present in everyday electrical and electronic devices. It is a multiple-step sequence of photographic and chemical processing steps during which electronic circuits are gradually created on a wafer made of pure semiconducting material.
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Semiconductor Wafer Bonding
Wafer bonding is a method used in semiconductor manufacturing by silicon on insulator (SOI) technology. In wafer bonding the insulating layer is formed by directly bonding oxidized silicon with a second substrate. The majority of the second substrate is subsequently removed, the remnants forming the topmost Si layer.
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