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Cdte: 145 results found.

nitridesiliconwafers.com Silicon Wafers
Nitride coated wafers. Stoichiometric, low stress and super low stress nitride in stock
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quartz-wafers.com Silicon Wafers
Quartz wafers fused and single crystal for research and production. All diameters and thicknesses. Small orders welcome. Fast Delivery
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appliedmaterial.org Applied Material
Applied material.
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brokenwafers.com Broken Wafers
Broken wafers.
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kohetching.com KOH Etching
Etching is used in microfabrication to chemically remove layers from the surface of a wafer during manufacturing.
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material-science.net Material Science
Material science is an interdisciplinary field involving the properties of matter and its applications to various areas of science and engineering.
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pdmsmicrofluidics.com PDMS Microfluidics
PDMS stamps are pieces of Polydimethylsiloxane (PDMS) that have been patterned usually against a master to form a relief pattern used in soft lithography. This PDMS stamp can be used in either its current form as a relief surface for techniques such as Micro Contact Printing or can also be attached to an external source by tubing so that liquid may be past through channels on its surface. It is possible to pattern PDMS to micrometre scale. These kinds of devices are often referred to as microfluidic devices.
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quartzwafer.net Quartz Wafer
Quartz Wafers for research or production.
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Similar Sites: universityquartz.com
semiconductorprocessing.net Semiconductor Processing
Semiconductor device processing is used to create the integrated circuits (silicon chips) that are present in everyday electrical and electronic devices. It is a multiple-step sequence of photographic and chemical processing steps during which electronic circuits are gradually created on a wafer made of pure semiconducting material.
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Similar Sites: semiconductorprocessing.org
semiconductorwaferbonding.com Semiconductor Wafer Bonding
Wafer bonding is a method used in semiconductor manufacturing by silicon on insulator (SOI) technology. In wafer bonding the insulating layer is formed by directly bonding oxidized silicon with a second substrate. The majority of the second substrate is subsequently removed, the remnants forming the topmost Si layer.
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