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Bourns - Automotive - Automotive
Bourns , Inc is a global manufacturer of electronic components such as automotive electronic components, circuit protection , magnetic & resistive products, connectors, diodes, microelectronic modules, sensors, switches, transistors and thyristors. Our broad portfolio provides solutions for business sectors like automotive manufacturing, consumer electronics, retail and industrial systems, medical technology, network communications, business machines, computing and telecommunications.
Bournsautomotive.com ~
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Aeroflex Corporation - Aeroflex
Our customers have complex, high-performance requirements and are predominantly found in the aerospace, defense, wireless mobile, broadband communications and advanced manufacturing markets. Aeroflex has developed substantial intellectual property through decades of collaborative design, manufacturing, R&D and service experience with customers.
Jcair.com ~
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Mirror Semiconductor Open Air Cavity QFN Package Solutions. Pre moulded substrates. Premolded substrates. Pre-molded air cavity package. Protype IC packaging for MPW Multi-Project wafer MPW. MPC Multi-Project Chip MPC. IC foundry wafer shuttle. Wafer foundry services. Wafer foundries . . .
Microelectronic assembly, microelectronic pkg, microelectronic packaging, microelectronic packages, microelectronic package types, microelectronic parts . . .
Microelectronics assembly, microelectronics pkg, microelectronics packaging, microelectronics packages, microelectronics package types, microelectronics parts . . .
Semiconductor assembly, semiconductor pkg, semiconductor packaging, semiconductor packages ,
semiconductor parts, semiconductor package types, . . .
Semiconductors assembly, semiconductors pkg, semiconductors packaging, semiconductors packages, semiconductors package types, semiconductors parts semiconductor die . . .
IC assembly, IC assemblies, IC assembly packaging , IC assembly and test ...
Open cavity plastic package , open cavity plastic packages open cavity QFN, open cavity IC package, open cavity IC packages, Open cavity package, Open cavity packages . . .
Wire bonding , wire bond, wire bonding in microelectronics , wire bonding wire, wire bonding wedge . . .
Wirebonding , wirebond, wirebonding in microelectronics , wirebonding wire, wirebonding wedge . . .
Die bonding , Die bond, die bonding process , die bond process, die bonder , die bonder machine . . .
Chip Scale package, RF IC design , RFIC design, . . .
MEMSic , MEMS , MEMS Package , MEMS Packaging , MEMS IC , MEMSic , MEMS semiconductor , MEMS semiconductors , MEMS foundry , MEMS foundry service , MEMS foundry services, MEMS foundries , MEMS wafer , MEMS wafers ,
Wafer dicing ,
Air Cavity QFN Package. Organic Open Cavity for MEMS, RF, Sensors and Semiconductors.
Diesocket.com ~
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mirrorsemi.com
- mirrorsemiconductor.com
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